![]() ![]() Bhan, Effect of residual stress on modal patterns of MEMS vibratory gyroscope. Zhang, Gradient residual stress induced elastic deformation of multilayer MEMS structures. Senturia, Microfabricated structures for the in-situ measurement of residual stress, Young’s Modulus and ultimate strain of thin-films. Tittonen, Dopant-induced stress in micro-fabricated silicon devices. Bhadeshia, Residual stress Part 2 – Nature and origins. Bhadeshia, Residual stress Part 1 – Measurement techniques. Yaish, Young’s modulus, residual stress, and crystal orientation of doubly clamped silicon nanowire beams. Pal, Diffusion induced residual stress in comb-type micro-accelerometer structure. Chatterjee, Effect of residual stress on RF MEMS switch. de Boer, Determination of Thin Film Coefficient of Thermal Expansion and Residual Strain from Free-Standing Fixed–Fixed Beams (J Sci. Goldsmith, A new in situ residual stress measurement method for a MEMS thin fixed–fixed beam structure. Haque, Thermo-mechanical coupling and size effects in micro and nano resonators. Lin, MEMS Materials and Processes Handbook (Springer, New York, 2011). Bhattacharya, Effect of vacuum packaging on bandwidth of push–pull type capacitive accelerometer structure. Richards, A facility for characterizing the dynamic mechanical behavior of thin membranes for microelectromechanical systems. Serrano, Simultaneous mapping of temperature and stress in micro-devices using micro-Raman spectroscopy. Wereley, Fundametals and Applications of Microfluidics (Artech House, Massachusetts, 2002). Chatterjee, Fabrication of comb structure with vertical sidewalls in Si (110) substrate by wet etching in boiling KOH solution. Baumgartel, Anisotropic Etching of Crystalline Silicon in Alkaline Solutions: II Influence of Dopants. Baumgartel, Anisotropic Etching of Crystalline Silicon in Alkaline Solutions: I Orientation Dependence and Behavior of Passivation Layers. Ohring, Materials Science of Thin Films-Deposition & Structure (Academy Press, Cambridge, 2006). Uttamchandani, Direct comparison of stylus and resonant methods for determining Young’s modulus of single and multilayer MEMS cantilevers. McWhorter, Materials issues in microelectromechanical devices: science, engineering, manufacturability and reliability. Griffin, Silicon VLSI Technology–Fundamentals (Prentice Hall Publication, New Jersey, Practice and Modelling, 2000).Ī.D. El-Kareh, Fundamentals of Semiconductor Processing Technology (Kluwer Academy Pub, Amsterdam, 1995). Motooka, Handbook of Silicon Based MEMS Materials and Technologies (William Andrew Appl, Science Pub, Norwich, 2010).ī. Gopalakrishnan, Smart Material Systems and MEMS: Design and Development Methodologies (Wiley, New Jersey, 2006). Liu, A (Not so) Short Introduction to MEMS (Femto ST Institute, France, 2018). De LosSantos, Introduction to Micro-Electro-Mechanical (MEMS) Microwave Systems (Artech House, Boston, London, 2004).į. Petersen, Silicon as a mechanical material. Madau, Fundamental of Micro-Fabrication–The Science of Miniaturization (CRC Press, New York, 2002). Howe, Laterally driven polysilicon resonant microstructures. Howe, Surface micromachining for microsensors and microactuators. Feynman, “There’s Plenty of Room at the Bottom”, presented at the American Physical Society Meeting in Pasadena, CA, December 26, 1959. The brief overview of the possible route to minimize the residual stresses is also presented. Few important case studies are discussed to highlight the effect of residual stress (generated during various fabrication processes) on characteristics of different MEMS structures. Different techniques involved in testing and characterization of the residual stresses are reviewed. This paper reviewed the origins of residual stress in MEMS fabrication processes. Thus, the evaluation and regulation of residual stress are one of the crucial aspects to assess the functioning of modern-day MEMS devices. The residual stress may significantly affect the performance and reliability of the fabricated devices. Residual stress is one of the most common outcomes during this integration/stacking of distinctly different materials for the fabrication of novel MEMS structures. MEMS devices typically comprise several deposited thick and thin films as well as bonded of dissimilar materials (like silicon, metal, glass, etc.). This also brings various associated challenges that are otherwise being ignored in a simple macro-dimensional system. The multidisciplinary nature of MEMS employs knowledge of diverse technical areas to realize improved and novel transducer systems. Micro-electro-mechanical system (MEMS) technology has radically changed the scale, performance, and cost of a wide variety of sensors and actuators by taking advantage of batch fabrication. ![]()
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